Mfg Part Number: B2S129W | NSN : 5962-01-075-8003 | NIIN : 010758003 |
CAGE Code : 18324 | Manufacturer: Philips Semiconductors Inc | Item Name : Microcircuit Memory |
FSC : 5962 Microcircuits Electronic |
If you are in the market for NSN 5962-01-075-8003 NSN part of Microcircuit Memory, that of which is listed with the description “Microcircuit Memory,” we have you covered at Integrated Parts Online. This Philips Semiconductors Inc NSN part is specifically listed alongside the part number B2S129W for your reference, and you may begin the procurement process for this offering at any time through the completion of the RFQ form provided below on this page. As you fill out our RFQ form for part number B2S129W, please offer us information such as your target price and shipping time frame, and we will utilize your details to tailor a customized solution for your comparisons. With team members ready to tend to customer needs at all times, we guarantee a response to quote requests within 15 minutes of receiving a completed form.
While NSN 5962-01-075-8003 is manufactured by Philips Semiconductors Inc, it is specifically produced under the CAGE Code 18324. To ensure that you only procure the exact parts you need like part number B2S129W under FSC 5962 Microcircuits Electronic , we always list items alongside all applicable information such as CAGE Codes, NSNS, part numbers, and more. Furthermore, every purchased part ships out alongside its applicable qualifying certifications and manufacturing trace documentation as a part of our NO CHINA SOURCING pledge. Get in touch with a team member today and experience our hands-off procurement process where we handle everything from logistics management to sourcing for you.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-075-8003 Item Description: Microcircuit Memory | 5962 | 010758003 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
B2s129w | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND BIPOLAR AND 3-STATE OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 5.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 89.0 |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 82577-932820 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
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