Mfg Part Number: UPD2364EC | NSN : 5962-01-266-3207 | NIIN : 012663207 |
CAGE Code : 33297 | Manufacturer: Nec Electronics Usa Inc | Item Name : Microcircuit Memory |
FSC : 5962 Microcircuits Electronic |
If you are in the market for NSN 5962-01-266-3207 NSN part of Microcircuit Memory, that of which is listed with the description “Microcircuit Memory,” we have you covered at Integrated Parts Online. This Nec Electronics Usa Inc NSN part is specifically listed alongside the part number UPD2364EC for your reference, and you may begin the procurement process for this offering at any time through the completion of the RFQ form provided below on this page. As you fill out our RFQ form for part number UPD2364EC, please offer us information such as your target price and shipping time frame, and we will utilize your details to tailor a customized solution for your comparisons. With team members ready to tend to customer needs at all times, we guarantee a response to quote requests within 15 minutes of receiving a completed form.
While NSN 5962-01-266-3207 is manufactured by Nec Electronics Usa Inc, it is specifically produced under the CAGE Code 33297. To ensure that you only procure the exact parts you need like part number UPD2364EC under FSC 5962 Microcircuits Electronic , we always list items alongside all applicable information such as CAGE Codes, NSNS, part numbers, and more. Furthermore, every purchased part ships out alongside its applicable qualifying certifications and manufacturing trace documentation as a part of our NO CHINA SOURCING pledge. Get in touch with a team member today and experience our hands-off procurement process where we handle everything from logistics management to sourcing for you.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-266-3207 Item Description: Microcircuit Memory | 5962 | 012663207 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Upd2364ec | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.300 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.519 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.225 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | +0.0/+60.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | 3-STATE OUTPUT AND POSITIVE OUTPUTS AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | PLASTIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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