Mfg Part Number: GF00000975 | NSN : 5962-01-306-5559 | NIIN : 013065559 |
CAGE Code : K0978 | Manufacturer: Bae Systems | Item Name : Microcircuit Memory |
FSC : 5962 Microcircuits Electronic |
If you are in the market for NSN 5962-01-306-5559 NSN part of Microcircuit Memory, that of which is listed with the description “Microcircuit Memory,” we have you covered at Integrated Parts Online. This Bae Systems NSN part is specifically listed alongside the part number GF00000975 for your reference, and you may begin the procurement process for this offering at any time through the completion of the RFQ form provided below on this page. As you fill out our RFQ form for part number GF00000975, please offer us information such as your target price and shipping time frame, and we will utilize your details to tailor a customized solution for your comparisons. With team members ready to tend to customer needs at all times, we guarantee a response to quote requests within 15 minutes of receiving a completed form.
While NSN 5962-01-306-5559 is manufactured by Bae Systems, it is specifically produced under the CAGE Code K0978. To ensure that you only procure the exact parts you need like part number GF00000975 under FSC 5962 Microcircuits Electronic , we always list items alongside all applicable information such as CAGE Codes, NSNS, part numbers, and more. Furthermore, every purchased part ships out alongside its applicable qualifying certifications and manufacturing trace documentation as a part of our NO CHINA SOURCING pledge. Get in touch with a team member today and experience our hands-off procurement process where we handle everything from logistics management to sourcing for you.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-306-5559 Item Description: Microcircuit Memory | 5962 | 013065559 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Gf00000975 | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
MEMORY | ABHP | OVERALL LENGTH1 280 INCHES MAXIMUM |
MEMORY | ADAT | BODY WIDTH4 40 MILLIMETERS MAXIMUM |
MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING1 0 WATTS |
MEMORY | AFJQ | STORAGE TEMP RANGE-65 0 TO 150 0 DEG CELSIUS |
MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
MEMORY | TEST | TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
MEMORY | CTQX | CURRENT RATING PER CHARACTERISTIC120 00 MILLIAMPERES MAXIMUM SUPPLY |
MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC7 0 VOLTS MAXIMUM POWER SOURCE |
MEMORY | CZER | MEMORY DEVICE TYPEEPROM |
MEMORY | ABMK | OVERALL WIDTH0 320 INCHES MAXIMUM |
MEMORY | ADAU | BODY HEIGHT5 59 MILLIMETERS MINIMUM AND 7 87 MILLIMETERS MAXIMUM |
MEMORY | AFGA | OPERATING TEMP RANGE-55 0 TO 125 0 DEG CELSIUS |
MEMORY | CQWX | OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
MEMORY | CQZP | INPUT CIRCUIT PATTERN15 INPUT |
MEMORY | ABKW | OVERALL HEIGHT0 400 INCHES MAXIMUM |
MEMORY | ADAQ | BODY LENGTH32 51 MILLIMETERS MAXIMUM |
MEMORY | CBBL | FEATURES PROVIDEDBURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
MEMORY | CTFT | CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510 |
MEMORY | TTQY | TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT |
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